Performance comparison of advanced power electronic packages for automotive applications
Abstract
The paper presents an overview over advanced power electronic package solutions for multi-chip modules. To assess their thermal performance, simulation models of the packages are analysed regarding the temperature distribution in the assemblies. The improvement which may be achieved with double-sided cooling of the modules is simulated and compared to the standard chip & wire module. From the simulations, the transient impedance of the chip?s hot-spot is derived and further processed in an automotive case study.
