Thermal Management for 3D-Packages with Fluidical Cooling
High integrated electronic PCB boards for high power applications needs new cooling Concepts. The 3D-Packaging technology makes it possible to stack PCBs on top of each other and thus make full use of the third dimension. The new SMT compatible Technology will be demonstrated on an 3D-PCB-Package in 11 PCB-layer with water cooled high power components (48 W). Water channels in the PCB-package dissipate the heat from the inside of the package to the environment. All channels are metallized with copper (Cu) and nickel/gold (NiAu). Thermal vias dissipate the heat from the electronic components to the water channels. Active fluidic parts can be integrated with the solder ring technology. A unique space between the stacked PCB layers enables a reproducible and inexpensive technology without shortcuts or unconnected bumps. The 3D-PCB-Packages with spacers are more reliable and got a unique shape. 3D-PCB-Packages in a combination of electrical components, fluidical cooling and thermal management in a technology with stacking technology, thermal vias/layers, PCB water channels with solder rings and unique spacers can be an inexpensive technology for high integrated power applications.
MicroCar 2005. Micro materials, nano materials for automotives. Volume of Abstracts