2005
Conference Paper
Titel

Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Author(s)
Hutter, M.
Thomas, T.
Jordan, R.
Engelmann, G.
Oppermann, H.
Reichl, H.
Wang, Y.
Howlader, M.
Higurashi, E.
Suga, T.
Hauptwerk
Konferenz
Thumbnail Image
Language
English