Fabrication end-test of the micro scanning mirror
New MEMS device are perpetually being proposed and concepts are approved by means of demonstrator devices. Volume production of MEMS however requires more. The fabrication process must be suitable for large numbers of wafers at acceptable cost and yield. Devices must be tested and packaged. Both are major cost factors. Reliability must be qualified. Finally the product must compete with other (established ?) solutions in cost, performance and reliability. We report on the fabrication end-test of the micro scanning mirror, a MEMS device for the resonant large-angle deflection of a laser beam at low operation voltage. The end-test involves: 1. wafer-level end-test of critical parameters on 100% of the chips, 2. full characterization of a random sample, and 3. reliability tests on representative samples. Emphasis is put on the wafer-level end-test of the mechanical properties.