Paper-thin ICs for Future Smart Label Applications
Papierdünne ICs für zukünftige Smart-Label-Anwendungen
One of the most growing markets for integrated circuits is the area of electronic tags, tickets and labels. These products will be the beginning of an emerging market of throwaway electronics, which will be fabricated in very high volumes, but also very low cost. To meet these aims reel-to-reel processes with high throughput have to be developed. For its flexibility and its property to be thinner than the substrate foil, ultra thin silicon are ideal for rolled substrates.