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Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
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2001
Conference Paper
Titel
Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Author(s)
Auersperg, J.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Kieselstein, E.
Schubert, A.
Michel, B.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Hauptwerk
Threaded and riveted connections, design issues, reliability, design issues, reliability stress analysis, and failure prevention
Konferenz
International Mechanical Engineering Congress and Exposition (IMECE) 2001
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
