Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC

For increasing the reliability and lifetime of micro components and systems their behaviour under mechanical or/and thermal has to be known. Size and geometry of the elements to be investigated make high demands on the measuring equipment. It is possible to determine and to evaluate the local displacements and displacement fields by the combination of the optical measuring procedure UNIDAC (Universal Deformation Analysis by Correlation), a method of digital image processing, and suitable equipments for mechanical testing. Digitized images of the specimen under different loadings are compared by using a correlation algorithm. The deformation behaviour of material compounds and components under loading as well as further information on physical and mechanical quantities may be derived from the obtained displacement fields. In this paper results of investigations based on a combination of UNIDAC and the 3-point-bending test are shown. The bending strength and the Young's modulus of materials can be determined. It is possible to pursue in-situ crack initiation and crack propagation and to investigate the interface strength interfacial and adhesion by this method. Examples with different material compounds and components of micro system technology will be presented.