The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 5m. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or even paper. Possible applications for such systems are electronic labels, tickets or security papers. For these systems different die bonding and electrical interconnection methods can be used. The paper describes new fundamentals for interconnection of ultra thin ICs and systems to flexible substrates.
