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  4. Wafer bonding with an adhesive coating
 
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1998
  • Konferenzbeitrag

Titel

Wafer bonding with an adhesive coating

Abstract
The assembly process for microelectromechanical systems often requires a wafer-joining process using low temperatures. In this work a bonding process is investigated, which uses thin adhesive films to stack silicon wafers. The method can be extended to form patterned adhesive coatings using stamping technique. Characterization of the process has been carried out with respect to adhesion, hermeticity and chemical stability of the adhesive bond.. in several applications this adhesive bonding process has been successfully applied to assemble sensors and actuators
Author(s)
Klink, G.
Hillerich, B.
Hauptwerk
Micromachined devices and components IV
Konferenz
Micromachining and Microfabrication Symposium 1998
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Language
Englisch
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IFT
Tags
  • adhesive

  • MEMS

  • sealing

  • stamping technique

  • wafer bonding

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