Micromechanical relay with electrostatic actuation
Three variants of electrostatically driven microrelays are reported. The concepts of these microrelays are a cantilever beam, a fixed-fixed beam and a torsion beam with a double contact configuration. Because of the complete fabrication by surface micromachining technology, there is no need for a chip bonding process. This paper reports on the device concept, fabrication and performance of the microrelay.