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  4. Steps towards the use of DSPI for high temperature strain measurement
 
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1996
  • Konferenzbeitrag

Titel

Steps towards the use of DSPI for high temperature strain measurement

Abstract
This paper describes a systematic study of influences that have to be overcome for the application of interferometry in the high temperature range. A specially designed test facility including an optical arrangement is used for the investigation of CMC specimens. Verification tests are performed up to 1500 deg C with combinded thermal-mechanical load sets. The fringe quality achieved allows to evaluate a field of displacement and strain data. Experimental experience gained is convincing to reach even higher temperatures and to test CMC components as well.
Author(s)
Aswendt, P.
Höfling, R.
Hauptwerk
Optical inspection and micromeasurements
Konferenz
International Symposium on Laser, Optics and Vision for Productivity in Manufacturing 1996
Conference "Optical Inspection and Micromeasurements" 1996
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Language
Englisch
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  • high temperature stra...

  • digital speckle patte...

  • ceramic matrix compos...

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