Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil

(A1) Die vorliegende Erfindung betrifft eine metallhaltige Zusammensetzung, ein Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie ein mit einer derartigen Kontaktierung versehenes elektronisches Bauteil.

DE 102008032554 A1 UPAB: 20100209 NOVELTY - Metal containing composition comprises (a) 20-80 wt.% of at least an electrically conductive metal powder, a powder of a metallic alloy and/or at least a metal organic compound of the conductive metal; (b) at least a first oxidic material from glass, ceramics or metal oxides and/or glass, ceramic and/or metal oxide containing metals derived from metal organic compound and/or its mixtures; and (c) at least a second oxidic material from ceramics and/or metal oxides and/or ceramic and/or metal oxide containing metals derived from metal organic compound or its mixture. DETAILED DESCRIPTION - Metal containing composition comprises (a) 20-80 wt.% of at least an electrically conductive metal powder, a powder of a metallic alloy and/or at least a metal organic compound of the conductive metal; (b) at least a first oxidic material from glass, ceramics or metal oxides with a melting point of less than 1000 degrees C and/or glass, ceramic and/or metal oxide containing metals derived from metal organic compound and/or its mixtures; and (c) at least a second oxidic material from ceramics and/or metal oxides with a melting point of at least 1100 degrees C and/or ceramic and/or metal oxide containing metals derived from metal organic compound or its mixture. An INDEPENDENT CLAIM is included for the preparation of an electronic contact structure on an electronic component comprising applying the composition on the contact structure to be produced on the electronic component, and heating the component containing composition in contact at 400-900 degrees C. USE - The metal containing composition is useful for the preparation of a contact structure on an electronic component, preferably solar cell (claimed). ADVANTAGE - The metal containing composition exhibits high electrical conductivity, good electrical contact, adhesion, high mechanical adhesion and good solderability.