Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging

Adhesives are widely used in electronic packaging and of vital importance of the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in life time prediction. Unfortunately, most of the common reliability test are destructive. The present approach combine the non-destructive methods Electrochemical Impedance Spectroscopy (EIS) and the Fourier Transformed Infrared Spectroscopy (FTIR) as a powerful tool in complementary manner to describe the degradation mechanism and kinetics of two epoxy based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the life time.