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On the crack and delamination risk optimization towards 3D-IC-integration
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2014
Book Article
Titel
On the crack and delamination risk optimization towards 3D-IC-integration
Author(s)
Auersperg, J.
Auerswald, E.
Oswald, S.
Machani, K.V.
Rzepka, S.
Michel, B.
Hauptwerk
Smart systems integration for micro- and nanotechnologies
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
