Wettability, chemical and morphological data of hydrophobic layers by plasma polymerization on smooth substrates

Plasma polymer layers were deposited from perfluoropropene plasma on rough and polished silicon wafers. Deposition was performed in a novel plasma apparatus using a special electrode arrangement for high lateral homogeneity of the deposits. The deposition parameters were optimized to develop highly hydrophobic layers with good de-wetting properties and adherence. The best results could be achieved by using a pulse plasma with on/off ratios of 1/5 ms. The water contact angle under receding conditions could be enhanced up to 97 degree.