Title

Stress Induced Phenomena and Reliability in 3D Microelectronics

Title Supplement

28-30 May 2012, Kyoto, Japan

Person Involved

Corporate Author

American Institute of Physics -AIP-, New York

Publisher

Publishing Place

New York, N.Y.

Publication Date

2014

Series

AIP Conference Proceedings; 1601

ISBN

978-0-7354-1235-4

Conference