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  4. Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies
 
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2002
Conference Paper
Title

Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies

Abstract
Life Cycle Information is a valuable information with many benefits for the manufacturer of electronic components. The knowledge about the loads in use support ongoing trends to pay on availability and pay on production. Especially online analysis for condition monitoring is a challenging benefit. Current approaches to life cycle data acquisition and analysis are presented. The principles of condition monitoring are discussed. The concept of a Life Cycle Information Unit and a prototype are presented.
Author(s)
Middendorf, A.
Griese, H.
Reichl, H.
Grimm, W.
Mainwork
Integrated Reliability Workshop Final Report, 2002. IEEE International  
Conference
International Integrated Reliability Workshop (IRW) 2002  
DOI
10.1109/IRWS.2002.1194262
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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