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2018
Conference Paper
Title
Ferrite embedding for Power SiPs – a packaging view
Abstract
This paper presents an investigation of mechanical interaction between Epoxy Mold Compounds (EMC) and magnetic cores. The verification is realized by the identification of core material property changes during molding employing core loss measurements before and after this technological process. A suitable loss measurement method is introduced and ferrite analysis on macroscopic and microscopic scale are provided. Finally, the results are discussed and conclusions for the design of magnetic components in Power SiPs are drawn.
Author(s)
Language
English