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  4. Ferrite embedding for Power SiPs – a packaging view
 
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2018
Conference Paper
Title

Ferrite embedding for Power SiPs – a packaging view

Abstract
This paper presents an investigation of mechanical interaction between Epoxy Mold Compounds (EMC) and magnetic cores. The verification is realized by the identification of core material property changes during molding employing core loss measurements before and after this technological process. A suitable loss measurement method is introduced and ferrite analysis on macroscopic and microscopic scale are provided. Finally, the results are discussed and conclusions for the design of magnetic components in Power SiPs are drawn.
Author(s)
Thomas, Tina  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Schneider-Ramelow, Martin  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Hoffmann, Stefan  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Becker, Karl-Friedrich  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Walter, Hans
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Bader, Volker  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Braun, Tanja  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Hoene, Eckart  
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Mainwork
CIPS 2018, 10th International Conference on Integrated Power Electronics Systems  
Conference
International Conference on Integrated Power Electronics Systems 2018  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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