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PublicationSensor Systems for Extremely Harsh Environments( 2023-10-31)Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean and energy efficient operation or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently the use of sensor systems is impossible, due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project ‘eHarsh’ to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are not only pure sensor elements, rather containing one or multiple sensor elements and integrated readout electronics. Various technologies which are necessary for the realization of such sensor systems have been identified, developed and finally bundled in a technology platform. These technologies are e. g. MEMS and ceramic based sensors, SOI-CMOS based integrated electronics, board assembly and laser based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization and reliability simulations. Based on the platform a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.
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PublicationCu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration( 2023)Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air. This research paper describes a method of Cu passivation using a self-assembled monolayer (SAM) to protect the surface against oxidation. However, this approach faces two main challenges: the degradation of the SAM at room temperature in the ambient atmosphere and the monolayer desorption technique prior to Cu-Cu bonding. In this paper, the systematic investigation of these challenges and their possible solutions are presented. The methods used in this study include thermocompression (TC) bonding, X-ray photoelectron spectroscopy (XPS), shear strength testing, scanning electron microscopy (SEM), and energy dispersive X-ray spectroscopy (EDX). The results indicate nearly no Cu oxidation (4 at.%) for samples with SAM passivation in contrast to the bare Cu surface (27 at.%) after the storage at −18 °C in a conventional freezer for three weeks. Significant improvement was observed in the TC bonding with SAM after storage. The mean shear strength of the passivated samples reached 65.5 MPa without storage. The average shear strength values before and after the storage tests were 43% greater for samples with SAM than for the bare Cu surface. In conclusion, this study shows that Cu-Cu bonding technology can be improved by using SAM as an oxidation inhibitor, leading to a higher interconnect quality.
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PublicationSensor Systems for Extremely Harsh Environments( 2022-10-01)Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project “eHarsh” to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.
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PublicationSensor Systems for Extremely Harsh Environments( 2022)Sensors are key elements for the detection of environmental properties and are indispensable in industrial applications for process monitoring and intelligent control of processes. While highly integrated sensor systems are already state -of-theart in many everyday areas, the situation in an industrial environment is significantly different. The use of sensor systems is often not possible because the extreme environmental conditions of industrial processes such as high operating temperatures or strong mechanical loads do not allow the reliable operation of sensitive electronic components. As part of the Fraunhofer Lighthouse project eHarsh, eight institutes have bundled their competencies and created a technology platform as a basis for the development of sensor systems for extremely harsh environments.
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PublicationSmart sensor systems for extremely harsh environments( 2021)Sensors systems are key elements for capturing environmental properties and are increasingly important in industry 4.0 for the intelligent control of processes. However, under harsh operating conditions like high temperatures, high mechanic load or aggressive environments, standard electronics cannot be used. Eight Fraunhofer institutes have therefore bundled their competencies in sensors, microelectronics, assembly, board design, laser applications and reliability analysis to establish a technology platform for sensor systems working under extreme conditions.
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PublicationPlattformkonzept zum Aufbau von hochintegrierten Multisensorknoten( 2019)Diese Veröffentlichung stellt das Konzept und die dazugehörige Packaginglösung einer universellen IoT Sensorplattformmit einer System-on-Chip (SoC) Familie als zentrale Steuer- und Recheneinheit vor. Die Plattform besteht aus 4 Ebenen, die angefangen vom hochintegrierten SoC, über die Montagemöglichkeit von gehäusten wie auch ungehäusten Sensoren bis hin zum System Board, was die üblichsten drahtgebundenen und drahtlosen Schnittstellen zur Verfügung stellt. Das Layout zur Sensormontage kann auf individuelle Kundenwünsche angepasst werden, um so spezielle Anforderungen an die Messaufgabe zu ermöglichen. Die Kerntechnologie des Packages besteht aus einem Moldpackage in Fan-Out Technologiemit unterseitiger Umverdrahtung des SoC zu den Balling Pads und Durchführungen zur oberseitigen Umverdrahtungfür die Montage der Sensoren.
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PublicationFunctional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications( 2018)Functional integration on the micro/nano scales enables smart functionalities in mechanical engineering systems. Here, exemplarily shown for a ball screw drive, a structure-integrated wireless sensor technology is implemented into a manufacturing system for advanced process control and status monitoring - even at machine components being not yet accessible or difficult to access. This includes also a miniaturized, networked and energy-efficient information and communication technology (ICT) integrated into the machine.
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PublicationHOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature( 2016)
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PublicationFraunhofer cluster 3D integration - key to a holistic technology and service approach( 2014)3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.
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PublicationFraunhofer cluster 3D integration( 2014)3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IISEAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration. The presentation will show the complex correlation of the different aspects of 3D integration and demonstrate the synergies that are met by the new Fraunhofer cluster and that enable the positioning as a competent and broad project, technology and service partner for industrial clients.
