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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
On the crack and delamination risk optimization of a Si-interposer for LED packaging
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS