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Technology aware modeling of 2.5D-SiP for automation in physical design

: Richter, C.; Polityko, D.-D.; Hefer, J.; Gutowski, S.; Reichl, H.; Berger, M.; Nowak, U.; Schroeder, M.


Vaidyanathan, K. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2007, 9th Electronics Packaging Technology Conference. Vol.2 : 10 - 12 December 2007, Grand Copthorne Waterfront Hotel, Singapore
New York, NY: IEEE, 2007
ISBN: 1-4244-1324-9
ISBN: 978-1-4244-1324-9
Electronics Packaging Technology Conference (EPTC) <9, 2007, Singapore>
Fraunhofer IZM ()
system-in-package; 3D; Modellierung; AVT; Entwurf; SipExpert; TechComposer; tool

The vertical integration within the System-in-Package (SiP) approach is becoming more and more important. While System-on-Chip (SoC) and PCB design teams are operating with highly developed EDA tools, there is a lack of automation tools for the design of SiP. This is particularly true for the engineering of so called 2.5D SiP, which integrate heterogeneous components (IC's, passives etc.) over several vertical layers/modules. For these system component placement today is a time consuming task. Even more important is the lack of a tool support for technology selection. This paper presents a new method for component autoplacement for folded and stacked 2.5 D SiP integrated with technology selection on an objective basis. We propose a design approach that is based on the simultaneous consideration of numerous layout solutions. We discuss the structuring of physical design, present a novel modeling of technological components for folded and stacked 2.5D SiP, and sketch algorithms for technology constrained automated placement, based on multicriteria optimization. Together with a multicriteria decision support tool this results in a novel design approach for 2.5D SiP.