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Integrated metrology. An enabler for advanced process control (APC)

: Schneider, C.; Pfitzner, L.; Ryssel, H.


Kissinger, G. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
In-line characterization, yield, reliability, and failure analysis in microelectronic manufacturing
Bellingham/Wash.: SPIE, 2001 (SPIE Proceedings Series 4406)
ISBN: 0-8194-4107-4
Conference on In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing <2, 2001, Edinburgh>
Fraunhofer IIS B ( IISB) ()
Mikroelektronik; Fertigung; integrierte Meßtechnik; in situ-Meßtechnik; Prozeßkontrolle; Fehlererkennung; Lithographie; Partikelmessung; cluster tool; sensor; Plasmadiagnose

Advanced process control (APC) techniques become more and more important as short innovation cycles in microelectronics and a highly competitive market requires cost-effective solutions in semiconductor manufacturing. APC marks a paradigm shift from statistically based techniques (SPC) using monitor wafers for sampling measurement data towards product wafer control. The APC functionalities including run-to-run control, fault detection, and fault analysis allow to detect process drifts and excursions at an early stage and to minimize the number of misprocessed wafers. APC is being established as part of factory control systems through the definition of an APC framework. A precondition for APC is the availability of sensors and measurement methods providing the necessary wafer data. This paper discusses integrated metrology as an enabler for APC and demonstrates practical implementations in semiconductor manufacturing.