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Reactive Bonding

 
: Vogel, Klaus; Braun, Silvia; Hofmann, Christian; Weiser, Mathias; Wiemer, Maik; Otto, Thomas; Kuhn, Harald

:

Esashi, Masayoshi (Ed.):
3D and Circuit Integration of MEMS
Weinheim: Wiley-VCH, 2021
ISBN: 978-3-527-34647-9
ISBN: 978-3-527-82323-9
ISBN: 978-3-527-82325-3
ISBN: 978-3-527-82324-6
ISBN: 3-527-34647-3
S.309-329
Englisch
Aufsatz in Buch
Fraunhofer IKTS ()
Fraunhofer ENAS ()

Abstract
Reactive material systems (RMS) are a new energetic material for wafer bonding application. They have a well-defined heterogeneous structure. While particle and foil-based RMS only have limited relevance for microelectronics, thin film layers show a great potential as energy source for chip and wafer boning. Reactive material thin films generate energy based on a self-propagating high temperature reaction. Further developments focus on the transfer of the reactive bonding process from component to wafer level. A homogeneous deposition of RMS is essential for the development of a bonding process on chip and wafer level. Physical vapor deposition (PVD) can be used for the deposition of various RMS. The deposition of reactive multilayers by PVD enables a homogeneous and uniform coating of chips and wafers with a large variety of material systems. Bonding based on RMS utilizes a self-propagating reaction to form a stable bond between two substrates.

: http://publica.fraunhofer.de/dokumente/N-635386.html