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Control of the Mechanical Adhesion of III-V Materials Grown on Layered h-BN

: Vuong, Phuong; Sundaram, Suresh; Mballo, Adama; Patriarche, Gilles; Leone, Stefano; Benkhelifa, Fouad; Karrakchou, Soufiane; Moudakir, Tarik; Gautier, Simon; Voss, Paul L.; Salvestrini, Jean-Paul; Ougazzaden, A.


ACS applied materials & interfaces 12 (2020), Nr.49, S.55460-55466
ISSN: 1944-8244
ISSN: 0013-936X
ISSN: 1944-8252
Fraunhofer IAF ()
2D boron nitride; III-nitrides; semiconductors; mechanical transfer; flexible (opto) electronics; transferrable nanodevices

Hexagonal boron nitride (h-BN) can be used as a p-doped material in wide-bandgap optoelectronic heterostructures or as a release layer to allow lift-off of grown three-dimensional (3D) GaN-based devices. To date, there have been no studies of factors that lead to or prevent lift-off and/or spontaneous delamination of layers. Here, we report a unique approach of controlling the adhesion of this layered material, which can result in both desired lift-off layered h-BN and mechanically inseparable robust h-BN layers. This is accomplished by controlling the diffusion of Al atoms into h-BN from AlN buffers grown on h-BN/sapphire. We present evidence of Al diffusion into h-BN for AlN buffers grown at high temperatures compared to conventional-temperature AlN buffers. Further evidence that the Al content in BN controls lift-off is provided by comparison of two alloys, Al0.03B0.97N/ sapphire and Al0.17B0.83N/ sapphire.More over, we tested that management of Al diffusion controls the mechanical adhesion of high-electron-mobility transistor(HEMT) devices grown on AlN/h-BN/sapphire. The results extend the control of two-dimensional (2D)/3D hetero-epitaxy and bring h-BN closer to industrial application in optoelectronics.