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InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements

: Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Marin-Palomo, P.; Hartmann, W.; Billah, M.R.; Troppenz, U.; Möhrle, M.; Randel, S.; Freude, W.; Koos, C.


Institute of Electrical and Electronics Engineers -IEEE-:
Optical Fiber Communications Conference and Exhibition, OFC 2020. Proceedings : San Diego, California, USA, 8–12 March 2020
Piscataway, NJ: IEEE, 2020
ISBN: 978-1-9435-8071-2 (IEEE)
ISBN: 978-1-7281-6762-6 (OSA)
Optical Fiber Communications Conference and Exhibition (OFC) <2020, San Diego/Calif.>
Fraunhofer HHI ()

We demonstrate an InP/Silicon integrated ECL using a photonic wirebond as intra-cavity coupling element. In our proof-of-concept experiments, we demonstrate 50 nm tuning range, SMSR above 40 dB, and linewidths of 750 kHz.