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The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs

: Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki

Volltext urn:nbn:de:0011-n-5903090 (1.0 MByte PDF)
MD5 Fingerprint: 00e2b88aa34ccf997ed3656ef94e8b8e
Erstellt am: 4.6.2020

Otto, Thomas (Hrsg.) ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2019 : 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems, Barcelona, Spain, 10 - 11 April 2019
Berlin: VDE-Verlag, 2019
ISBN: 978-3-8007-4919-5
ISBN: 978-3-8007-4878-5
Smart Systems Integration Conference (SSI) <2019, Barcelona>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <13, 2019, Barcelona>
European Commission EC
H2020; 737497; EuroPAT-MASIP
European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package
Deutsche Forschungsgemeinschaft DFG
194654001; MERGE
Technologies for Multifunctional Lightweight Structures
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ENAS ()

A method is presented to create a validated scheme for the virtual prototyping of System-in-package (SiP) products based on fan-out-wafer-level-packaging (FOWLP) technologies. It involves the material characterization of molding compound by dynamic mechanical analysis, warpage measurement of a package using MicroProf measurement system, finite element (FE) analyses using a parametric FE model of an automotive inertial sensor created by modular system of models in ANSYS, model validation and sensitivity analyses using optiSLang. In order to prevent the fracture in copper pad metallization and solder ball, a new optimization criteria is defined based on interface stresses in order to optimize different geometry parameters like thickness and diameter of under bump metallization (UBM) and pad.