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Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components

: Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C.

Volltext ()

Micromachines 10 (2019), Nr.3, Art.185, 22 S.
ISSN: 2072-666X
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer ENAS ()

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.