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Flip-Chip Integration of InP and SiN

: Theurer, M.; Moehrle, M.; Sigmund, A.; Velthaus, K.-O.; Oldenbeuving, R.M.; Wevers, L.; Postma, F.M.; Mateman, R.; Schreuder, F.; Geskus, D.; Wörhoff, K.; Dekker, R.; Heideman, R.G.; Schell, M.


IEEE Photonics Technology Letters 31 (2019), Nr.3, S.273-276
ISSN: 1041-1135
Fraunhofer HHI ()

We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms. The design enables efficient high optical power coupling over a wide temperature range. The optical modes of laser and SiN chip are expanded using integrated tapers allowing for high alignment tolerance. The chips comprise physical alignment stops for vertical alignment. In the horizontal direction, the integration interface is optimized for active and/or visual alignment with high precision using precise visual alignment marks. The hybrid integrated chip shows a waveguide coupled optical power of more than 40 mW and can operate at elevated temperatures up to 85 °C.