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Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

: Schroeder, T.; Froemel, J.; Tanaka, S.; Gessner, T.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 : Matsushima Bay and Sendai MEMS City, Japan, 17-20 April, 2016
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-1948-9 (Print)
ISBN: 978-1-5090-1947-2
ISBN: 978-1-5090-1946-5
International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) <11, 2016, Matsushima Bay, Sendai>
Fraunhofer ENAS ()

For the further miniaturization of integrated circuits, the integration of passive components on the chip is one approach. In DC-DC converter applications, the integration of the inductor with high inductivity is one problem. This paper addresses this problem by proposing a new technique for fabricating a multilayer spiral coil that is also useful as part of electromagnetic MEMS (Micro-Electro-Mechanical Systems) actuators. The multilayer coil is made by stacking separately fabricated coil layers and joining them with a selective bonding and debonding technique.