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Improved RF design using precise 3D near-field measurements and near-field to far-field transformations

: Hangmann, C.; Mager, T.; Khan, S.; Hedayat, C.; Hilleringmann, U.

Geßner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2016. Proceedings : International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick
Auerbach: Verlag Wissenschaftliche Scripten, 2016
ISBN: 978-3-95735-040-4
ISBN: 3-95735-040-9
Smart Systems Integration Conference (SSI) <2016, Munich>
International Conference and Exhibition on Integration Issues of Miniaturized Systems <10, 2016, Munich>
Fraunhofer ENAS ()

For electronic systems EMC measurements are unavoidable whereas they have to be performed at an expensive EMC certified institution. They are done at the end of the design process and thus limit the designer to efficiently achieve an EMC compliant system. Hence, this paper discusses a novel method that allows an EMC characterization by exploiting the EM near-field scan data on a Huygens-Box and processing it into the far-field. Based on this far-field a pass or fail of EMC tests can be predicted accompanying the RF design flow. Furthermore, the used measured near-field data constitutes a very efficient radiation model of complex electronic systems for further investigation.