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Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments

: Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas


Claeys, Cor (Ed.) ; Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
China Semiconductor Technology International Conference, CSTIC 2016 : March 13 - 14, 2016, Shanghai, China
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-4673-8805-4
Art. 7463912, 4 S.
China Semiconductor Technology International Conference (CSTIC) <2016, Shanghai>
Fraunhofer IMS ()
Fraunhofer ENAS ()
Fraunhofer IKTS ()
Fraunhofer IMWS ()
high temperature; SOI CMOS; MEMS; Trench capacitor; CMOS circuits; chip scale packages; cmos integrated circuits; high temperature applications

This paper gives an overview of technologies and materials for microsystems and electronics in harsh environmental applications including the fabrication of a multifunctional MEMS with platinum metallization, high-temperature stable CMOS circuits and trench capacitors, ceramic-based packaging technologies as well as analysis of material parameters, simulation and reliability testing.