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Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C

: Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe

International Microelectronics and Packaging Society -IMAPS-:
International Conference on High Temperature Electronics Network, HiTEN 2015 : Cambridge, United Kingdom, 6 - 8 July 2015
Red Hook, NY: Curran, 2015
ISBN: 978-1-5108-1033-4
International Conference on High Temperature Electronics Network (HiTEN) <2015, Cambridge>
Fraunhofer IMS ()
EEPROM; high temperature; reliability; SPICE simulation; retention; endurance; oxide charge; SOI

The paper presents reliability studies of single polysilicon EEPROM cells at temperatures from 50 °C to 450 °C. The technically challenging measurements at elevated temperatures above 250 °C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved.