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Development of 3-D redistribution and balling technologies for fabrication of vertical power devices

: Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.

SMTA News and Journal of Surface Mount Technology 18 (2005), Nr.1, S.27-35
Fraunhofer IZM ()

Based on the electroless wafer-level redistribution technology, the development of a rerouting technology for vertical power transistor devices which includes the wiring through a via in the silicon wafer from the back to the front side was realized. The basic technology approaches as well as the stencil printing of preformed solder balls will be presented and discussed.