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Large area mold embedding technology with PCB based redistribution

: Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.


IEEE Components, Packaging, and Manufacturing Technology Society:
35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, IEMT 2012 : Ipoh, Perak, Malaysia, 6 - 8 November 2012
Piscataway: IEEE, 2012
ISBN: 978-1-4673-4386-2
ISBN: 978-1-4673-4384-8
International Electronics Manufacturing Technology Conference (IEMT) <35, 2012, Ipoh>
Fraunhofer IZM ()

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.