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Challenges of smart system integration

: Gessner, T.; Vogel, M.; Hiller, K.; Otto, T.; Bertz, A.; Billep, D.


Wu, H. ; Electrochemical Society -ECS-:
China Semiconductor Technology International Conference, CSTIC 2010 : March 18 - March 19, 2010, Shanghai, China
Pennington, NJ: ECS, 2010 (ECS transactions 27, 1)
ISBN: 978-1-56677-806-0 (CD-ROM)
ISBN: 978-1-60768-156-4 (PDF)
ISSN: 1938-5862
China Semiconductor Technology International Conference (CSTIC) <2010, Shanghai>
Fraunhofer ENAS ()

As a result of the growing complexity and miniaturization of innovative products systems integration is becoming more and more important for scientific and technical development. The micro and nano system technologies as well as electronics are playing a key role in today's product development and industrial progress. They enable the integration of mechanical, electrical, optical, chemical, biological and other functions into a very small space with dimensions ranging from sub micrometers up to some millimeters. This paper presents three examples of MEMS sensors developed at Fraunhofer ENAS and Chemnitz University of Technology and the approaches for their integration into smart systems. The first one is an active radio frequency identification label for the monitoring of shock, inclination and temperature during transportation processes. A MEMS spectrometer and gyroscopes will be demonstrated. Special emphasis is given to MEMS /nanointegration.