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A new method of flip chip assembly using a light silver filled glue

: Feil, M.; König, M.; Bock, K.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.1 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0533-X
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Fraunhofer IZM-M

Automated and cost-efficient manufacturing processes are of paramount importance for low-cost mass products. One for a bottle neck of the of manufacturing transponder is the present chip assembly. ICs are assembled by flip chip adhesive technology using anisotropic or non-conductive adhesives. Simultaneous, both pressure and temperature are required, meaning a high process engineering complexity for mass products. An adhesive, lighty filled with Ag, is used in the proposed new development. Pressure is required but momentarily during placing the chip. For curing only temperature is used. Contact resistance in the range of mOhm and insulation resistance between neighboring bond pads of >20 MOhm were realised and proofed by test chips.