Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Highly integrated flexible electronic circuits and modules

: Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H.


3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, IMPACT 2008 : 22 - 24 Oct. 2008, Taipei. Held in conjunction with International Conference on Electronic Materials and Packaging (EMAP)
Piscataway: IEEE, 2008
ISBN: 978-1-4244-3624-8 (print)
ISBN: 978-1-424-43623-1
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) <3, 2008, Taipei>
Fraunhofer IZM ()

Within the electronic circuit board industry flexible circuit still cover a small the market share, however, with the fastest growth rate. The technology is increasingly used in automotives and aerospace, in handheld mobile appliances and many medical devices like pace makers or hearing aids [1,2]. Over past years a European consortium of research institutes and industry has explored the future technological potential of flexible printed circuits in the framework of the project SHIFT. One aspect was to investigate the frontiers of flexible circuit fabrication with respect to minimum feasible line width and pitch using different manufacturing methods. Still further beyond today mainstream flex fabrication technologies were the developments to integrate active and passive components into the buildup layers of flex circuits. In this way extremely high integration of electronic systems and highest functional densities can potentially be realized. Techniques and results of t hese developments will be presented in this paper.