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Microring resonators fabrication by BCB adhesive wafer bonding

: Dragoi, V.; Alexe, M.; Hamacher, M.; Heidrich, H.


Suga, T. ; Electrochemical Society -ECS-, Electronics and Photonics Division:
Semiconductor Wafer Bonding 10. Science, Technology, and Applications : Tenth International Symposium on Semiconductor Wafer Bonding; Honolulu, Hawaii, on October 14-16, 2008
Pennington: Electrochemical Society, 2008 (ECS transactions 16,8)
ISBN: 978-1-56677-654-7
ISBN: 978-1-60768-007-9
ISSN: 1938-5862
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <10, 2008, Honolulu/Hawaii>
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) <2008, Honolulu/Hawaii>
Electrochemical Society (Meeting) <214, 2008, Honolulu/Hawaii>
Electrochemical Society of Japan (Fall Meeting) <2008, Honolulu/Hawaii>
Fraunhofer HHI ()
Bonden; Wellenlängenmultiplex; Ringresonator; Wafer-Montage; Galliumindiumphosphid; Cyclobuten; dreidimensionale Struktur

Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding. Different materials and wafer bonding processes were tested. The successful fabrication process was using BCB wafer-to-wafer adhesive bonding.