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Testing microcomponents by speckle interferometry

Untersuchung von Mikrokomponenten mittels Speckleinterferometrie
: Aswendt, P.; Höfling, R.; Hiller, K.

Gorecki, C. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; European Optical Society -EOS-:
Microsystems metrology and inspection
Bellingham/Wash.: SPIE, 1999 (Europto series)
ISBN: 0-8194-3311-X
S.165-173 : Ill., Lit.
Conference on Microsystems Metrology and Inspection <1999, München>
Fraunhofer IWU ()
deformation; speckle interferometry; vibration; microscopy; microsensors; MEMS testing

Design, manufacturing and test of microcomponents generate new challenges for measurement techniques in general. The non-contacting operation of optical metrology makes it attractive to solve the task of measuring geometric quantities of microparts. So far, speckle interferometry (ESPI) is well established as a measuring tool for analyzing deformation, vibration and strain on a macroscopic level. This paper deals with possibilities and application limits of ESPI in the case of scaling down the object size below one millimeter. In a first part, both spatial resolution and displacement sensitivity of the technique are discussed. Theoretical considerations are shown together with experimental verification. Secondly, a micro speckle interferometer will be presented that has been built for the use with different microscopes. Its capabilities are demonstrated by a practical application. The microcomponent under investigation is a bulk micromachined gyroscope, a demanding object with respect to its multilayer design. Developments aim at increasing the spatial resolution step by step and results obtained with different field of view will demonstrate the progress. Finally, the deformation behaviour of an X-shaped torsional spring with a width of 100 mu m could be characterized.