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Improved control of TiN coating properties using cathodic arc evaporation with a pulsed bias.

Bessere Kontrollierbarkeit der TIN- Schichteigenschaften durch die Verwendung einer gepulsten Biasspannung im Arc-Prozeß

McGuire, G.E.:
Metallurgical Coatings and Thin Films 1991. Proceedings of the 18th International Conference. Vol.1
Amsterdam: Elsevier, 1991 (Surface and coatings technology 49)
ISBN: 0-444-89455-1
International Conference on Metallurgical Coatings and Thin Films <18, 1991, San Diego/Calif.>
Journal Article, Conference Paper
Fraunhofer IPA ()
Biasspannung; Cathodic Arc Deposition; Lichtbogendampfen; Metallische Schichten; Oberfläche; Oberflächenbearbeiten; Schutzschicht; vapor deposition

A combined d.c.-pulse vias voltage was used in combination with a cathodic arc evaporation process for the deposition of TiN on planar plates and drilling tools at substrate temperatures T between 330 and 500 xC. This new pulse technique appeared to be powerful tool to achieve independent control of the substrate temperature, coating adhesion and univormity of deposition. As a result, high coating adhesion can be obtained at low substrate temperatures. The adhesion uniformity across large-area samples is considerably improved. Unpolished rough substrate parts can be coated without cauliflower-like growth defects. Because of intensive ion bombardment in the pulse period, smoother TiN coatings with a reduced droplet size were obtained.