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High Performance Gold Plating for Microdevices

: Gemmler, A.; Keller, W.; Richter, H.; Rueß, K.

Plating and Surface Finishing 81 (1994), No.8, pp.52-58
ISSN: 0360-3164
Journal Article
Fraunhofer IPA ()
gedruckte Schaltung; Gold Plating; Goldüberzug; microelectronic device; Mikroelektronik; Plating; Schutzschicht

Gold bumps of high quality have been electrodeposited from a sulfitic gold electrolyte. Periodic recording, both of existing process data and resulting layer properties, yielded a synergistic model to maintain the reliability of the plating process. Sources of nodules and pits, or voids were characterized using SEM and acoustomicroscopy. Further factors that influence quality of gold deposits (hardness, roughness, unitormity) could be optimized.