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High performance gold plating for microdevices

 
: Gemmler, A.; Keller, W.

American Electroplaters and Surface Finishers Society -AESF-, Orlando/Fla.:
SUR/FIN '92. Bd.1
Orlando/Fla., 1992
pp.553-573
American Electroplaters and Surface Finishers Society (Annual Technical Conference) <79, 1992, Atlanta/Ga.>
English
Conference Paper
Fraunhofer IPA ()
Gold Plating; Goldüberzug; Leiterplatte; microelectronic device; Mikroelektronik; Plating; Schutzschicht

Abstract
Tremendous improvements in the performance of microelectronic devices have been creating increased demands on fabrication control and consequent application of a synergistic operational model, high quality gold layers have been deposited from a sulfitic gold electrolyte. Periodic recording both of existing process data and resulting layer properties yielded a synergistic model to control the plating using SEM and acoustomicroscopy. Futher factors that influence quality of gold deposits (hardness, roughness, uniformity) could be optimized by flexible process control.

: http://publica.fraunhofer.de/documents/PX-17089.html