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Nano-structured interconnects for system integration

: Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-; Hong Kong University of Science and Technology:
EMAP 2006, 8th International Conference on Electronic Materials and Packaging. CD-ROM : 11-14 Dec, 2006, Hong Kong
New York, NY: IEEE, 2006
ISBN: 1-4244-0834-2
International Conference on Electronic Materials and Packaging (EMAP) <8, 2006, Hong Kong>
Conference Paper
Fraunhofer IZM ()

Microelectronics miniaturization is following Moore's law since the mid sixties and over the years it has always been possible to follow it without meeting fundamental technological limits. This might be in question for future applications, where SIA roadmap shows a red brick wall for the further development of microelectronics without fundamentally new approaches. New approaches like single electron and CNT based transistors do all target on maximum integration on chip level, leading to increased interconnect density and thus to a miniaturization of the individual contact. Parallel to the miniaturization of IC structures the development of finest pitch interconnect technologies is necessary, providing reliable infrastructure for future packaging needs. At Fraunhofer IZM various approaches towards finest pitch interconnect technologies are under development. This paper will describe work on realization of interconnects using nanoscale structures as NanoLawn or CNT-Arrays. Our working hypothesis is the formation of mechanically and electrically functional interconnects by mechanical interlocking of nano-scale structures. In the case of NanoLawn these structures comprise e.g. gold rods 2 µm height and diameters down to 50 nm, while CNT arrays consist of CNTs with lengths of 10 µm and diameters around 8 nm. Experimental data indicate optimized bonding conditions and interconnect quality with the approaches described. Potential areas of application are the interconnection of fine pitch devices or e.g. thermally sensitive devices as bio-sensors or interconnection on low cost substrates, e.g. for the smart card applications or the expanding RFID tag market. The principle of the interconnection technology is described and first technological work on interconnection technology will be discussed.