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Interposer based wide IO processor integration

 
: Heinig, Andy; Fischbach, Robert; Dittrich, Michael

Surface Mount Technology Association -SMTA-:
11th International Wafer-Level Packaging Conference, IWLPC 2014. CD-ROM : San Jose, California, November 11th - 13th, 2014
San Jose/Calif., 2014
6 pp.
International Wafer-Level Packaging Conference (IWLPC) <11, 2014, San Jose/Calif.>
English
Conference Paper
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
3D integration; interposer; WideIO; Thermal simulation; technology comparison

Abstract
Further improvements in system performance are often limited by the achievable bandwidth between processor and memory. In this paper we look at interposer-based and stacked solutions to integrate processor and memory into a high performance system. The comparison reveals the current advantages of interposer-solutions. This is underlined by thermal and technological considerations. Even though physical design tradeoffs are existent, we show an actual implementation of the chosen technology.

: http://publica.fraunhofer.de/documents/N-337138.html