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Euclidean move surface decomposition of non-planar surfaces for the electronic system design

: Steinhardt, Alexander; Heinig, Andy

European Institute of Printed Circuits -EIPC-; MESAGO Messe Frankfurt GmbH:
Connecting the world. Proceedings. CD-ROM : ECWC13, 13th Electronic Circuits World Convention, 7 – 9 May 2014, Nuremberg, Germany
Berlin: VDE-Verlag, 2014
ISBN: 978-3-8007-3606-5
6 pp.
Electronic Circuit World Convention (ECWC) <13, 2014, Nürnberg>
Conference Paper
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
surface decomposition; euclidean move; 3D-MID; flexible electronics

Electronic systems with devices placed on a nonplanar surface became more important in the last years because
such systems are appropriate to fulfill the increased requirements given by the interaction of functional and geometrical design of an electronic system. The new requirements for functional design results from smaller form factors, product designer constraints, and the integration of more functionality into the same space. It is necessary to find an area with a warp of the surface smaller as a given threshold for the placement of electronic devices(components)-like chips, capacitors, resistors, and so on-onto the non-planar surface. In this paper we present a novel surface decomposition approach to determine maximal areas that have a warpage smaller than a given threshold on a non-planar surface that is shown in an example at the end.