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Innovation driver of the next decade: Heterogeneous integration

Innovationmotor der nächsten Dekade: Heterogene Integration
: Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael

Chip scale review 16 (2012), No.2, pp.21-25
ISSN: 1526-1344
Journal Article
Fraunhofer IZM ()

The use of micro--level integration technologies to manufacture high-end systems (such as in microelectronics, microsystem technology and sensor technology) has increased dramatically around the world. Little wonder, as their potential for application is almost infinite. Particularly the automotive and mobile communications industries were advancing development in this area. The trend towards increasing the benefits of a product is also leading to a fast growing demand for integration of miniaturized sensors, autonomous power supplies and standardized communication functions in other sectors, such as safety and security, energy and medical engineering.
This change is reflected in national and international technology and product road maps, such as those of the German Electrical and Electronic Manufacturers' Association (ZVEI) and the US-based IEEE. Such publications repeatedly speak of a fundamental change in the structure of our society. Optimally adapting electronics to the product and its typical application environment is a basic requirement in such developments. The electronics should not get in the way of using the product or disturb the user in any fashion. Further high-tech products are expected from systems that are developed across sectors, such as wireless, miniaturized sensor and transmission systems for medical or living environment monitoring that are combined with security and identification systems.
In summary, development demands and the market show two main trends helping to shape the ongoing development of system integration technologies:
- Firstly, an ongoing increase in the number of functions directly included in a system, which include electrical, optical, mechanical, biological and chemical processes, combined with the demand for higher reliability and longer system lifetime.
- Secondly, increasingly seamless merging of products and electronics, which necessitates adapting electronics to predefined materials, forms and application environments. Only by these means systems sensors and signal processing can be implemented near to the point where signals are occurring. (which are often installed in extremely harsh environments).