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Smart sensor systems - packaging technologies for multi-sensory consumer applications

Smarte Sensorsysteme - Gehäusetechnologien für Multi-Sensor-Anwendungen
: Jung, E.; Becker, K.-F.; Braun, T.; Aschenbrenner, R.

AMA Fachverband für Sensorik e.V., Wunstorf:
SENSOR 2009, 14th International Conference on Sensors, Technologies, Electronics and Applications. Vol.1 : Nürnberg, Germany, 26 - 28 May 2009; Proceedings; Part of Sensor + Test Conference 2009
Wunstorf: AMA Service, 2009
ISBN: 978-3-9810993-4-8
International Conference on Sensors, Technologies, Electronics and Applications (SENSOR) <14, 2009, Nürnberg>
Sensor + Test Conference <2009, Nürnberg>
Conference Paper
Fraunhofer IZM ()

The advent of monolithically integrated systems 'More than Moore' leveraging nanoscale technology for sensors and RF systems as well as the growing maturity of System on Chip (SoC) solutions have increased the function per area significantly. Packaging technology now enables to use these devices in a maximum level of integration, enabling also the use of the third dimension to a paradigm shift towards function per volume.