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Precision machining of future silicon wafers

: Klocke, F.; Pähler, D.

Inasaki, I. ; Japan Society of Precision Engineering -JSPE-, Tokyo:
Initiatives of precision engineering at the beginning of a millennium : July 18 - 20, 2001, Yokohama, Japan
Boston: Kluwer, 2001
ISBN: 0-7923-7414-2
International Conference on Precision Engineering (ICPE) <10, 2001, Yokohama>
Conference Paper
Fraunhofer IPT ()
Silizium; wafer; Rotationsschleifen; multi-wire slicen; subsurface damage

Ductile grinding of silicon wafers with superior surface quality and TTV is one way of precision machining. Most promising results are found with diamond grinding wheels using high grain concentrations and small D-size values. Innovative machining employing the ductile grinding mode are presented promising advantages for future generations to come.