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Precision machining of future silicon wafers. Grinding and slicing techniques for flawless qualities

: Klocke, F.; Pähler, D.

European Society for Precision Engineering and Nanotechnology -EUSPEN-:
Euspen 2nd International Conference 2001. Proceedings
Turin, 2001
pp.656-659 (Vol. 2)
European Society for Precision Engineering and Nanotechnology (International Conference) <2, 2001, Turin>
Conference Paper
Fraunhofer IPT ()
Silizium; wafer; Rotationsschleife; multi-wire slicen; sub-surface damage

Microchip device production depends heavily on high-quality silicon wafers. Current developments in the filed of wafer production focus on substituting the traditional production processes by a surface improving ductile material removal mechanism as well as the implementation of the multi-wire slicing (MWS) process as the industrial standard. Customised machining set-ups as well as fine-tuned process parameters are mandatory for flawless surface qualities of the wafers with sub-surface damages (SSD) down to SSD < 2 mu m. Most promising results are found with diamond grinding wheels using high grain concentrations and small D-size values.