Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, R.; Zufiria, P.G.; Giagka, V.; Serdijn, W.A.
Konferenzbeitrag
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Zeitschriftenaufsatz
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Zeitschriftenaufsatz
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Konferenzbeitrag
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Konferenzbeitrag
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Zeitschriftenaufsatz
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Zeitschriftenaufsatz
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Zeitschriftenaufsatz
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Konferenzbeitrag
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Zeitschriftenaufsatz
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Process modules for high-density interconnects in panel-level packaging
Schein, F.-L.; Kahle, R.; Kunz, M.; Kunz, T.; Kossev, J.; Müller, T.; Pentz, M.; Dietterle, M.; Ostmann, A.
Zeitschriftenaufsatz
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Zeitschriftenaufsatz
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Zeitschriftenaufsatz
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
Kossifos, K.M.; Petrou, L.; Varnava, G.; Pitilakis, A.; Tsilipakos, O.; Liu, F.; Karousios, P.; Tasolamprou, A.C.; Seckel, M.; Manessis, D.; Kantartzis, N.V.; Kwon, D.-H.; Antoniades, M.A.; Georgiou, J.
Zeitschriftenaufsatz
2020Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, F.; Etschmaier, H.; Dobs, T.; Walter, H.; Wittler, O.; Hadley, P.
Zeitschriftenaufsatz
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
Akgun, Omer Can; Nanbakhsh, Kambiz; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Schulz, S.; Heinrich, W.
Konferenzbeitrag
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Demumieux, P.; Avino-Salvado, O.; Buttay, C.; Martin, C.; Sixdenier, F.; Joubert, C.; Magambo, J.S.N.T.; Loher, T.
Konferenzbeitrag
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Zeitschriftenaufsatz
2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
Nanbakhsh, Kambiz; Kluba, Marta; Pahl, Barbara; Bourgeois, Florian; Dekker, Ronald; Serdijn, Wouter; Giagka, Vasiliki
Konferenzbeitrag
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Konferenzbeitrag
2019Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
Löher, Thomas; Ndip, Ivan; Lang, Klaus-Dieter
Patent
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Konferenzbeitrag
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Konferenzbeitrag
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Miniaturized 24 GHz Radar Positioning Transponder Module
Fritzsch, Thomas; Tschoban, Christian; Böttcher, Mathias; Windrich, Frank; Phung, Gia Ngoc; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
Kawasaki, S.; Giagka, V.; Haas, M. de; Louwerse, M.; Henneken, V.; Heesch, C. van; Dekker, R.
Konferenzbeitrag
2019Realisierung und Anwendung energieautarker miniaturisierter Funksensorik: Chancen durch IoT, 5G und Narrowband
Brockmann, Carsten; Günther-Sorge, Julia; Pötter, Harald
Zeitschriftenaufsatz
2019Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR)
Sirbu, B.; Tekin, T.; Weeber, J.C.; Dereux, A.; Markey, L.
Konferenzbeitrag
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2019Vorrichtung zur Erfassung von Objekten
Becker, Karl-Friedrich; Georgi, Leopold; Tschoban, Christian; Hommes, Alexander; Ebberg, Alfred; Hülsmann, Axel; Hofmann, Ulrich; Wantoch, Thomas von
Patent
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag