Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Monolithic integration of a smart temperature sensor on a modular silicon-based organ-on-a-chip device
Ponte, Ronaldo Martins da; Gaio, Nikolas; Zeijl, Henk van; Vollebregt, Sten; Dijkstra, Paul; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Zeitschriftenaufsatz
2020(How) can service design and digitalization be used to transition to the circular economy?
Scholz, Ronja; Malila, Saija; Vihma, Markus; Marwede, Max; Cygert, Karolina
Konferenzbeitrag
2020Assessment of the influencing parameters of the tumble test for robustness testing of smartphones
Dobs, Tom; Sánchez, David; Schischke, Karsten; Wittler, Olaf; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Bestandsaufnahme Smartphones. Übersicht Modellhistorie und modulare Konzepte
Proske, Marina; Baur, Sarah-Jane; Rückschloss, Jana; Teusch,Christoph; Krause, Thomas; Poppe, Erik
Bericht
2020Bidirectional Bioelectronic Interfaces: System Design and Circuit Implications
Liu, Yan; Urso, Alessandro; Martins da Ponte, Ronaldo; Costa, Tiago; Valente, Virgilio; Giagka, Vasiliki; Serdijn, Wouter A.; Constandinou, Timothy G.; Denison, Timothy
Zeitschriftenaufsatz
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, K.; MacKowiak, P.; Kröhnert, K.; Oppermann, H.; Jürgensen, N.; Wietstruck, M.; Göritz, A.; Tolunay Wipf, S.; Kaynak, M.; Lang, K.-D.
Konferenzbeitrag
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, Rui; Zufiria, Pedro G.; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Zeitschriftenaufsatz
2020Condition monitoring of power electronic modules for predictive maintenance
Wagner, Stefan; Wüst, Felix; Sehr, Frederic; Dobs, Tom; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Current State of Durability Assessment for Four Consumer Product Groups
Hahn, Daniel; Sehr, Frederic; Straube, Stefan; Dobs, Tom; Berwald, Anton; Wittler, Olaf; Schneider-Ramelos, Martin
Konferenzbeitrag
2020Customer acceptance of mobile devices with permanently installed batteries and accumulators
Winzer, Janis; Czichowski, Johanna; Lascho, Tobias; Bill, Stine; Hipp, Tamina; Wagner, Eduard; Jaeger-Erben, Melanie
Konferenzbeitrag
2020Decomposing software obsolescence cases - a cause and effect analysis framework for software induced product replacement
Wagner, Eduard; Poppe, Erik; Hahn, Florian; Jaeger-Erben, Melanie; Druschke, Jan; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2020Das Design bestimmt die Ökobilanz. Mobile Endgeräte im Umweltfokus
Schischke, Karsten
Zeitschriftenaufsatz
2020Design for and Design from Recycling: The Key Pillars of Circular Product Design
Dimitrova, G.; Berwald, A.; Feenstra T.; Höggerl, G.; Nissen, N.F.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Zeitschriftenaufsatz
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Konferenzbeitrag
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Konferenzbeitrag
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Zeitschriftenaufsatz
2020Environmental Impacts of Modular Design - Life Cycle Assessment of the Fairphone 3
Proske, Marina; Clemm, Christian; Sánchez Fernández, David; Ballester Salvà, Miquel; Jügel, Marvin; Kukuk-Schmid, Heike; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Extended Product Lifespan Abroad - Assessing Repair Sector in Ghana
Groscurth, Balthasar; Batteiger, Alexander; Deubzer, Otmar; Jaeger-Erben, Melanie
Konferenzbeitrag
2020Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven
Konferenzbeitrag
2020FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, A.; Jaeschke, J.; Wittler, O.; Fabian, B.; Thomas, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications
Schischke, K.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2019/2020
 
Jahresbericht
2020Grading system for post-consumer recycled plastics from WEEE
Wagner, Florian; Bracquene, Ellen; Wagner, Eduard; Keyzer, Jozefien de; Duflout, Joost R.; Dewulf, Wim; Peeters, Jef R.
Konferenzbeitrag
2020How long do we care? The role of consumer practices for sustainable electronics
Jaeger-Erben, Melanie; Hipp, Tamina; Frick, Vivian
Konferenzbeitrag
2020Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling
Schwietering, J.; Herbst, C.; Kirsch, O.; Arndt-Staufenbiel, N.; Wachholz, P.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020International Congress "Electronics Goes Green 2020+". Proceedings
: Schneider-Ramelow, Martin
Tagungsband
2020Life Cycle Assessment of the Fairphone 3
Proske, Marina; Sánchez, David; Clemm, Christian; Baur, Sarah-Jane
Studie
2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Low inductive full ceramic sic power module for high-temperature automotive applications
Klein, K.; Rämer, O.; Hoene, E.; Yasuda, Y.; Ito, H.; Kurita, F.; Enoki, M.; Nakamura, H.; Okishiro, K.
Konferenzbeitrag
2020Low voltage silicon photonic modulators and switches for high radix integrated transmitters
Brimont, A.; Zanzi, A.; Vagionas, C.; Pegios, M.M.; Vyrsokinos, K.; Pleros, N.; Kraft, J.; Sidorov, V.; Sirbu, B.; Tekin, T.; Sanchis, P.
Konferenzbeitrag
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Zeitschriftenaufsatz
2020Market Trends in Smartphone Design and Reliability Testing
Clemm, Christian; Berwald, Anton; Prewitz, Carolin; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Memory-assisted Statistically-ranked RF Beam Training Algorithms for Sparse MIMO
Tiwari, K.K.; Grass, E.; Thompson, J.S.
Konferenzbeitrag
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Zeitschriftenaufsatz
2020A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Konferenzbeitrag
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Zeitschriftenaufsatz
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Organizational transition management of circular business model innovations
Hofmann, F.; Jaeger-Erben, M.
Zeitschriftenaufsatz
2020Overview of Circular Economy Practices in High-tech Manufacturing Industries
Schischke, Karsten; Billaud, Mathilde; Reinhold, Julia; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
Bakhshaee, Nasim; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Process modules for high-density interconnects in panel-level packaging
Schein, Friedrich-Leonhard; Kahle, Ruben; Kunz, Marc; Kunz, Tim; Kossev, Jordan; Müller, Tobias; Pentz, Mathias; Dietterle, Michael; Ostmann, Andreas
Zeitschriftenaufsatz
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Zeitschriftenaufsatz
2020Real-time impedance monitoring of epithelial cultures with inkjet-printed interdigitated-electrode sensors
Mojena-Medina, D.; Hubl, M.; Bäuscher, M.; Jorcano, J.L.; Ngo, H.-D.; Acedo, P.
Zeitschriftenaufsatz
2020Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method
Woehrmann, M.; Keller, A.; Fritzsch, T.; Schiffer, M.; Gollhardt, A.; Walter, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2020Review of the List of Restricted Substance (Annex II) of Directive 2011/65/EU (RoHS)
Baron, Yifaat; Moch Katja; Clemm, Christian; Gensch, Carl-Otto; Koehler, Andreas; Deubzer, Otmar; Loew, Clara
Konferenzbeitrag
2020Robust converters for renewable energy plants
Bayer, Christoph Friedrich; Wagner, Stefan
Zeitschriftenaufsatz
2020Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Simulation challenges of warpage for wafer- and panel level packaging
Dijk, M. van; Kuttler, S.; Rost, F.; Jeaschke, J.; Walter, H.; Wittler, O.; Braun, T.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries
Elia, G.A.; Greco, G.; Kamm, P.H.; Garcia-Moreno, F.; Raoux, S.; Hahn, R.
Zeitschriftenaufsatz
2020The smartphone evolution - an analysis of the design evolution and environmental impact of smartphones
Proske, Marina; Poppe, Erik; Jaeger-Erben, Melanie
Konferenzbeitrag
2020A time-temperature-moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging
Huber, F.; Etschmaier, H.; Walter, H.; Urstöger, G.; Hadley, P.
Zeitschriftenaufsatz
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Zeitschriftenaufsatz
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
Kossifos, K.M.; Petrou, L.; Varnava, G.; Pitilakis, A.; Tsilipakos, O.; Liu, F.; Karousios, P.; Tasolamprou, A.C.; Seckel, M.; Manessis, D.; Kantartzis, N.V.; Kwon, D.-H.; Antoniades, M.A.; Georgiou, J.
Zeitschriftenaufsatz
2020Towards CMOS Bulk Sensing for In-Situ Evaluation of ALD Coatings for Millimeter Sized Implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Using Post-Consumer Recycled Plastics in new EEE. A promising Circular Business Model for the Electronics Sector
Maisel, F.; Emmerich, J.; Dimitrova, G.; Berwald, A.; Nissen, N.F.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Uv sensor based on fiber bragg grating covered with graphene oxide embedded in composite materials
Lesiak, P.; Bednarska, K.; Małkowski, K.; Kozłowski, L.; Wróblewska, A.; Sobotka, P.; Dydek, K.; Boczkowska, A.; Osuch, T.; Anuszkiewicz, A.; Lewoczko-Adamczyk, W.; Schröder, H.; Woliński, T.R.
Zeitschriftenaufsatz
2020Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, F.; Etschmaier, H.; Dobs, T.; Walter, H.; Wittler, O.; Hadley, P.
Zeitschriftenaufsatz
2020Wafer-Scale Graphene-Based Soft Electrode Array with Optogenetic Compatibility
Velea, Andrada Iulia; Vollebregt, Sten; Wardhand, Gandhika K.; Giagka, Vasiliki
Konferenzbeitrag
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
Akgun, Omer Can; Nanbakhsh, Kambiz; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Condition monitoring for failure monitoring of power electronic assemblies
Wagner, Stefan; Wuest, Felix; Trampert, Stefan; Sehr, Frederic; Middendorf, Andreas; Wittler, Olaf; Schneider-Ramelow, Martin
Konferenzbeitrag
2019Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Schulz, S.; Heinrich, W.
Konferenzbeitrag
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Demumieux, P.; Avino-Salvado, O.; Buttay, C.; Martin, C.; Sixdenier, F.; Joubert, C.; Magambo, J.S.N.T.; Loher, T.
Konferenzbeitrag
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Zeitschriftenaufsatz
2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
Nanbakhsh, Kambiz; Kluba, Marta; Pahl, Barbara; Bourgeois, Florian; Dekker, Ronald; Serdijn, Wouter; Giagka, Vasiliki
Konferenzbeitrag
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Konferenzbeitrag
2019Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
Löher, Thomas; Ndip, Ivan; Lang, Klaus-Dieter
Patent
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Konferenzbeitrag
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Konferenzbeitrag
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method
Bäuscher, M.; Reinicke, O.; Henke, M.; MacKowiak, P.; Schiffer, M.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Konferenzbeitrag
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Miniaturized 24 GHz Radar Positioning Transponder Module
Fritzsch, Thomas; Tschoban, Christian; Böttcher, Mathias; Windrich, Frank; Phung, Gia Ngoc; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
Kawasaki, S.; Giagka, V.; Haas, M. de; Louwerse, M.; Henneken, V.; Heesch, C. van; Dekker, R.
Konferenzbeitrag
2019Realisierung und Anwendung energieautarker miniaturisierter Funksensorik: Chancen durch IoT, 5G und Narrowband
Brockmann, Carsten; Günther-Sorge, Julia; Pötter, Harald
Zeitschriftenaufsatz
2019Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
Velea, Andrada Iulia; Vollebregt, Sten; Hosman, Tim; Pak, Anna; Giagka, Vasiliki
Konferenzbeitrag
2019Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR)
Sirbu, B.; Tekin, T.; Weeber, J.C.; Dereux, A.; Markey, L.
Konferenzbeitrag
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2019Vorrichtung zur Erfassung von Objekten
Becker, Karl-Friedrich; Georgi, Leopold; Tschoban, Christian; Hommes, Alexander; Ebberg, Alfred; Hülsmann, Axel; Hofmann, Ulrich; Wantoch, Thomas von
Patent
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag